hot melt adhesive

Category

Hot Melt Adhesive

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1000

Product serial number

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Product Description

1. Use

Polyamide hot melt adhesive is soluble in general organic solvents. It features for its good mechanical strength, good fluidity, excellent tenacity, and high adhesion strength. This product is fit to be used for the adhesion of materials like electric appliances, heat-shrinkable meterial, packing material, fabrics, leather, lumber, plastic, metal, ceramics, etc.

2. Performance Index

Grade	Performance Index
Grade	Viscosity mPa·S/25℃	Softening Point ℃	Acid Value mgKOH/g	Amine Value mgKOH/g	Tensile Strength MPa	Shear Strength MPa	Shear Rate %	Water Absorption Rate %	Used temperature
ZD-110	2500~4500	110±5	≤5	≤3	≥6	≥7	≥400	≤0.4	140-160℃
ZD-L110	1000~2500	110±5	≤5	≤3	≥5	≥6	≥100	≤0.4	140-160℃
ZD-160	4000~6000	160±5	≤5	≤3	≥13	≥10	≥250	≤0.4	190-200℃
ZD-H120	10000~20000	120±5	≤5	≤3	≥20	≥11	≥800	≤0.4	160-200℃